3D-Packaging using 3D-MID
Enabling the next level of miniaturization
The 3D-MID technology is currently in a phase of transformation; namely, it is getting smaller. Smaller in the sense of finer, it just makes the jump from the usual conductor track widths of 100 to 200 micro-meters in the direction of 10 to 20 micro-meters. 100 to 10 isn’t an improvement, that’s a giant leap. A huge leap, because the technology is making the leap from a technology as circuit carrier for SMD towards IC and chip substrate. The landing at the chip level was successful. This is proved by research projects on wafer level and by industrial projects on IC packaging level.
The new small world of MID circuits brings new challenges on the level of materials and processes. Our team is currently working passionately on developing the necessary processes for this. Material and equipment suppliers as well as research partners and customers are welcome to discuss with us the requirements, the restrictions and the possibilities in their respective areas. so that we can all get there faster.
Kind regards and best wishes
Nouhad