Link to 3D-MID Manufacturing Guidlines
https://www.vdi.de/richtlinien/details/vdivde-3719-herstellung-von-mechatronisch-integrierten-baugruppen-mechatronic-integrated-devices-mid
3dmid post-007
Update on 3D-MID Ultrashort Pulse Laser Laser structuring with subsequent metallization is one of the most common processes in the manufacture of 3D-MID parts. When it comes to laser structuring, a distinction is made between Laser Direct Structuring (LDS), Laser Subtractive Structuring (LSS), Laser Structuring – Chemical Activation (LS-ChA) and Photo-Chemical Structuring (Ph-Ch-S). The above …
3dmid post-006
New challenges require new solutions – 3D-MID for automotive applications In the history of mankind there has been hardly any other technology that is causing such emotion and enthusiasm as the automobile. The car offers personal mobility and freedom that characterizes our way of life. While we get used to this freedom and we don’t …
3dmid post-005
3D-Packaging using 3D-MID Enabling the next level of miniaturization The 3D-MID technology is currently in a phase of transformation; namely, it is getting smaller. Smaller in the sense of finer, it just makes the jump from the usual conductor track widths of 100 to 200 micro-meters in the direction of 10 to 20 micro-meters. 100 …
3dmid post-004
The semiconductor supply crisis How to tackle the challenge of complexity?! The bottleneck in semiconductor supply is currently on everyone’s lips. Sooner or later the crisis will surely be overcome, but this bottleneck indicates structural problems in the semiconductor industry that need to be addressed. Technically speaking, the manufacture of semiconductors is a highly complex …
3dmid post-003
Recommended sources of information about 3D-MID Information about technology on the Internet is a dime a dozen. However, knowledge or information about specific knowledge is rarely found. There could be two reasons for this. Either those who have the knowledge don’t share it because they don’t want their knowledge to end up with the competition …
3dmid post-002
Update on 3D-MID – Product robustness and reliability against environmental life tests.
Qualified series parts with fine pitch: LCP, PA4T, PC/PET and thermoset.
All parts passed the tests without any cracks and without any delamination.
3dmid post-001
3D-MID Manufacturing technologies