Processes

3dmid post-007

Processes / By

Update on 3D-MID  Ultrashort Pulse Laser Laser structuring with subsequent metallization is one of the most common processes in the manufacture of 3D-MID parts. When it comes to laser structuring, a distinction is made between Laser Direct Structuring (LDS), Laser Subtractive Structuring (LSS), Laser Structuring – Chemical Activation (LS-ChA) and Photo-Chemical Structuring (Ph-Ch-S). The above …

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3dmid post-005

General, Processes / By

3D-Packaging using 3D-MID Enabling the next level of miniaturization The 3D-MID technology is currently in a phase of transformation; namely, it is getting smaller. Smaller in the sense of finer, it just makes the jump from the usual conductor track widths of 100 to 200 micro-meters in the direction of 10 to 20 micro-meters. 100 …

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