3D Mechatronic integrated Device
“3D-MID” once stood as an abbreviation for three dimensional molded interconnect device, but now the technology is increasingly being referred to as three dimensional mechatronic integrated device.
The trend towards functional density, essential in almost all industries, requires more and more interconnects and more miniaturization of hardware components. 3D-MID offers a solution meeting both space and interconnect requirements. Also, serving as a 3D connectivity module saves space and reduces mass.
During our time, the technology that was initially intended for simple 3D molded components has transformed into a technology for true 3D mechatronic modules.
The technology
3D-MID is a multidisciplinary technology that combines mechanics and electronics in one single module. The 3D-MID parts consist of an injection molded plastic substrate, which acts as a carrier for a 3D circuitry and electronic components as well as connectivity parts such as connectors, cables, flex circuit lines etc.
There are several processes to manufacture 3D-MID products. The LDS process of LPKF (Laser Direct Structuring) is currently the most popular process to create the circuit on the substrate. After forming the 3D substrate by injection molding, the 3D circuitry is structured on the substrate by an IR laser beam with a spot diameter of 50 to 100 micro-meters. The structured area can be plated in a special chemical copper solution, followed by nickel, gold or other finishing layers. The electronic assembly is done then by pick and place machines. Assembly technologies such as soldering, bonding, conductive gluing, inserts, over molding etc. are used to connect the 3D-MID substrate to other components.
Applications areas
3D-MID offers its advantages wherever plastics and electronics meet; almost everywhere in current and future technical hardware. There are many possible applications of 3D-MID:
- Sensors
- Switches
- Antennas
- LED carriers
- Lighting modules
- Connectors and connectivity modules
- Miniaturized electronic packaging
- 3D circuits
- Security devices
3D-MID antenna module, and fine pitch security housing
